Knowledge

Electronics design begins with circuit design. The foundation stone for a successful implementation of the module requirements is already laid here. An outstanding knowledge of the material and process parameters of electronic printing in combination with the component characteristics used form the basis for the design of the circuit layout, the calculation of the process parameters and the selection of the components by SCIO.

Classical soldering requires temperatures above 200°C. Only a few, extremely expensive foils can be used for this. SCIO has developed a bonding process which makes it possible to bond electronic components even on inexpensive films such as PET, PMMA, PC or even paper. Electronic designs and components can thus be applied to almost any substrate material possible.

For long and safe use, electronics must also be protected: to protect electronic parts against external influences such as mechanical stress or moisture and weathering, e.g. when it is used outdoors, SCIO has developed various processes for a functionally optimised sealing in order to be able to offer an optimum solution depending on the operating conditions and on the technical requirements.

The development of the MulitLayer Flex2.0 is a milestone in printed electronics. The high electrical conductivity of the base structure allows almost endless linear applications (e.g. for linear LED strips) while the multi-layer technology is the basis for circuit design to integrate additional functions such as sensors or networking. Furthermore SCIO has developed this MultiLayer Flex2.0 with resource and environmental friendly additive printing processes.

Cost-effective electronics in 3-dimensional form? Through a careful selection of materials and processes, it is possible to manufacture electronic modules economically in a roll-to-roll process to form them in 3-dimensional forms or to refine the surface. In this way, the circuit board also becomes a surface. No openings, no push buttons - a clean, smooth surface with all functions integrated. And the entire assembly work of the inner parts is eliminated.

We always try to look beyond the horizon and open up new areas of possibility. The fascination of what is not (yet) possible is the muse of our innovation. We meet new challenges with curiosity and always strive to bring our projects to a successful conclusion with the greatest care of our customers.

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